Altium filled vias To configure the type of protection for vias: • Select the desired vias; • Set a type in the Properties panel; • Specify the coating side and material in the table. Vias are used to make transitions between layers in a design, so you will need to use them during layout and routing in a double-sided multilayer board. When a via type is set to IPC-4761, new types of mechanical layers and component layer pairs are automatically added to the design, with corresponding Nov 29, 2024 · Blind vias aren’t just for HDI PCBs, and they can be placed with an alternative process called backdrill-and-fill involving the use of a non-conductive epoxy. Aug 14, 2018 · Explore Altium CircuitStudio technical documentation for Via and related features. I am using Altium Designer 20. SMD components and vias on a green PCB The best manufacturers can likely produce any via you need. This plating connects to other pads in via-in-pad structures, as well as directly to a trace using a small annular ring. If there are two networks of VCC and GND in the drawn area, the Fill command will connect the elements of the two networks together, which may cause a short circuit. Aug 16, 2023 · Altium Designer, a leading PCB design software, offers a powerful set of tools for designing and managing vias efficiently. May 14, 2018 · Under the IPC-2226 standards, there are several standard PCB stackups used to support HDI PCB rouitng, which then allows trace routing into fine-pitch BGA components. Apr 27, 2020 · Altium Designer will display blind vias and buried vias with a split color on them so that you can easily tell which layer the via starts and stops on. Polygon Pour: Cut the copper pouring area. Via protection is a critical aspect of modern PCB design, enhancing manufacturability and assembly reliability while reducing defects. Mar 20, 2020 · I want to view the tracks and via's in Altium Designer 20 when I am in 3D view (shift+s is not what I want since that will hide the components and only show the tracks and via's). In this video, Tech Consultant Zach Peterson walks you through the exact process of enabling and Feb 18, 2021 · To Fill or Not to Fill Vias?|we are allocating less of the precious space on the board for relatively large plated through holes. Epoxy Filled Vias Definition: Refers to plugging non-conductive epoxy into via holes and then plating over the solder pads. Consider limitations on aspect ratio based on your board thickness. One of the options for routing into inner layers as part of fanout routing is to use skip vias. In that case they might offer the option to fill the via to avoid the issue. Vias can be used to connect component leads to signal traces or planes or to allow a signal to change signal layers. "Type 7" vias It looks even worse for via-in-pads (screenshot below is from official Altium documentation): Apr 22, 2021 · In this article, we will go over the fundamentals of via design using Altium Designer electronic design automation software. Our PCB fab house recommended that we plug the via to prevent solder from flowing into the via which might leave the pads with insufficient solder. But there are probably number of different technologies what can be used. May 1, 2023 · In Altium designer the via type can be declared as one of the follows: I know about tenting. What are the industry standard ways to provide this information to the manufacturer? I normally export my des Apr 13, 2020 · If a via is meant to carry current why not go for a solid copper filled via than a plated via (which is hollow/nonconductive at the center)? After all in electrical engineering, we dont go for a h Dec 9, 2021 · Experts here at Altium help you learn more about when to use tented vs. But why w May 23, 2017 · Have you ever wondered how designers pack so much functionality into such a small space? You can thank HDI design techniques and microvias in printed circuit design. Jul 11, 2019 · This page looks at definition of via types for your board through the Layer Stack Manager, including thru-hole vias, blind vias, buried vias, mico vias and skip vias Aug 31, 2018 · HDI PCBs with fine-pitch BGAs often use laser-drilled via-in-pad or microvia in-pad for BGA fanout routing. The use of copper-filled vias enhances heat dissipation, which is essential for high-power applications. Jan 3, 2024 · Filled and capped vias are advanced PCB design techniques that measurably enhance connection reliability. I am working in a small RF board on Altium Designer. Read on to learn more about what is a tented via and when you'd use them. 167mm diameter via under a BGA component to provide ground connections to two adjacent pads (ENIG-finish PCB). A via is a primitive design object. See full list on protoexpress. A Fill or Solid Region is a solid region similar to a polygon pour except it does not have options for fill style (like hatched), pour sequence, or connection style to vias and pads. Sep 3, 2025 · Manufacturing Process for PCB Via Filling The PCB via filling process involves several steps to ensure that vias are filled correctly and meet design specifications. The smaller via structures also reduce parasitic capacitance and inductance, leading to better performance in high-speed and RF designs. These small structures let traces reach inner layers of a PCB with high interconnect density and high layer count. Dec 12, 2022 · I have a PCB design in Altium with all of the IPC 4761 Via Types specified on each via. However, some fabricators will flag the potential issue of solder wicking into the via when attempting to solder. Why is it important to work under industry standard? Find out here. First, let's start with defining these terms since they can be frequently misused and misunderstood. May 4, 2023 · 8 A Rectangle is a non-filled set of connected tracks or lines limited to a rectangle shape (with corner options) which can be drawn on any layer. Most of the standard HDI PCB stackup constructions use a core (buried) via, and/or a through-hole via touching all layers. Simply remove the mask clearances from the Aug 19, 2022 · Via protection is an important part of modern PCB design. Here you can access a vast library of free training and Aug 26, 2025 · Discover the different types of via covering in PCB manufacturing, including tented, untented, plugged, epoxy-filled, and copper-epoxy-filled vias. Vias are a three-dimensional object, having a barrel-shaped body in the Z-plane, with a flat ring on each (horizontal Dec 11, 2021 · Designing towards IPC 6012 Class 3 annular ring standards can ensure your device meets industry reliability requirements. Sep 9, 2023 · Here are some tips for working with blind vias efficiently in your PCB design: Name blind vias appropriately (e. Learn when to use VIP and when to skip it. It all seems to be fine inside Altium however when i generate the drill files for each layer i notice that some holes are not shown on layers where i would expect them. For a short time, some information on this page may be outdated. Mar 22, 2021 · With the CAD tools in Altium Designer, you can design, place, and manage thermal vias for active components in your PCB. Dec 16, 2019 · 0 I have a 0. This way it won't cut through the silk screen or solder mask. Via-in-pad thermal are placed directly under the components pad to conduct the heat away. See below screenshot of what is supposed to be a type 7 (filled & capped) via. May 12, 2019 · Altium is transforming the electronics industry so thoroughly that our web pages need a minute to catch up. Mar 26, 2025 · This guide will explain what thermal vias are, how they work, and how to use them to master PCB heat management. Oct 26, 2020 · Learn how to create through-hole vias in Altium Designer 2020 and troubleshoot issues with layer stack-ups and drill pair manager. Read more today. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products. Given the tolerance requirements on vias, you should check with your manufacturer regarding their Aug 12, 2022 · In response to some of our previous videos, Tech Consultant Zach Peterson has been asked about when designers should do vias in pads - specifically surroundi Aug 28, 2018 · Copper Wrap Plating Structures Filled via-in-pad structures require via holes be copper plated in order to route signals between layers in a multilayer PCB. Ensure your component footprints Aug 22, 2018 · Explore Altium CircuitStudio technical documentation for Via and related features. Aug 21, 2022 · Unfortunately, I don't think Altium allows specification of filled and plated vias, though they should given what the software costs. It should not be hard to make these appear as simple copper from above. Learn design tips, placement rules, and cooling strategies for better performance. untented vias and discuss why they are often recommended in a PCB layout. It is used to form a vertical electrical connection between two or more electrical layers of a PCB. These tips will help you increase routing density and work with fine pitch components using via-in-pad designs. What is IPC-4761? IPC-4761 is a standard developed by the Association Connecting Electronics Via-in-Pad in Rigid-Flex Designs: When Space Is Tight, Details Matter 6 min Blog When space is tight, via-in-pad in rigid-flex demands filled vias, clean stackups, and stress control. FWIW, what you are asking for is an IPC Type VII via, as it is described in the IPC-4761 Standard. Minimize use of blind vias with high layer counts due to fabrication complexity. Jul 30, 2020 · A via that spans and connects from the top layer (red) to the bottom layer (blue), and also connects to one internal power plane (green). See what vias are and how the benefits of the using them. Learn more about copper-filled vias from MCL. Learn how to create new via types using the Layer Stack Manager, as well as how to create new Routing Via design rules using the PCB Rules and Constraints Editor. The copper capping provides a flat surface for soldering, while the conductive filling ensures efficient heat transfer. We would like to show you a description here but the site won’t allow us. May 25, 2018 · All high-density PCBs rely on specific via styles to make connections into the inner layers without taking up space for routing. 2. Some people think they can slightly offset a via from a pad and it will be fine. In most other professional PCB design tools, vias (the plated through connections Nov 2, 2011 · Hello, although I have checked the forum a few times I have never posted, but now I have a few issues that I hope you can help me with. Filled and capped vias These vias are filled with a thermally conductive material (copper or epoxy) and capped with copper on both ends. Apr 23, 2025 · Additionally, Ultra HDI improves power distribution and thermal management. Standard HDI PCB stackups might also use skip vias on the surface layer in addition to standard blind Oct 20, 2022 · Via Sizing, Spacing, and Standards In this article, we have examined the basics of vias in PCB design, looking at via parameters, such as drill and pad sizes, types of vias, and what vias can be used for, including transfer and stitching vias. Advantages of Via Protection Common situations where vias In some applications, vias are filled with soldermask material during the soldermask application process. When a via passes all the way through a PCB it is called a through hole via or through via. This is where a via is covered. A via in pad is not uncommon, so the chances are they will not even mention it. This approach provides a cost-effective way to fill vias while maintaining the overall manufacturing flow, though it offers limited structural and thermal benefits compared to dedicated filling materials. Here is how to design microvia-in-pad. There are 3 main options for via filling: Conductive and non-conductive via filling and copper-plated shut filled vias each with its uses and setbacks. Then, discover how to use these Any via types other than simple tented do not appear correctly in the 3D view. Many users of Altium Designer come from using other CAD tools like Cadence Allegro, OrCAD, P-CAD, or Mentor PADS. Learn their applications, advantages, Jan 24, 2018 · Fill: Draw a solid copper skin that connects all the wires and vias in the area, regardless of whether they belong to the same network or not. The challenge with vias, particularly among new designers, is they are often sized incorrectly such that they are un-manufacturable as designed. The color of a blind vias or buried vias will identify its start and stop layer In the picture above you have a thru-hole via on the left with a solid colored core. Jan 9, 2020 · PCB vias are essential in a multilayer circuit board and routing between layers. May 25, 2018 · Via-in-pad technology is critical in HDI designs. Via Tenting This is the easiest and least costly process—actually there is no added cost for this process. The IPC-4761 Design Guide for Protection of Printed Board Via Structures outlines multiple via protection methods, which are detailed on pages 5–11 of this document. g. For example, copper irrigation need to be Dec 20, 2018 · The filled via will prevent solder from wicking through the via hole and onto the bottom of the board when mounting through-hole components. Mar 18, 2019 · In this episode Gerry Partida a manufacturing expert and Director of Engineering at Summit Interconnect Technologies shares the 7 ways to protect your Vias and gives valuable info about IPC 4761. Oct 16, 2019 · A via is a drilled and plated hole in a PCB that allows a signal to pass from one side of a PCB to the other or to an inner layer. For example, i have a BGA on top layer using vias-in-pad (filled and plated). When selecting an appropriate land size for a via, there are a few places to start looking: Manufacturing cost: Opting for a larger via is going to carry lower manufacturing costs, as I’ve Jun 14, 2024 · View our complete list of resources on usage of blind and buried vias in HDI PCB design. Use the best toolset to define PCB vias for trace routing and circuit board layout. Feb 15, 2022 · Dance Altium Designer 22, the IPC 4761 options are directly applicable in the panel Properties de Through which channels you reach those people, classic and out of the box. The Altium Academy is an online experience created to bring modern education to PCB Designers and Engineers all across the world. This is my first time using this software and there are a few things I don't know how to do or if they Apr 25, 2017 · Capped or Filled Vias - In a related note, you should also talk to your manufacturer about any general vias in PCB designs that need to be capped or filled. This process is suitable for any type of via with soldermask openings on one side or via-in-pads with soldermask openings on both sides of the board. Learn when and why to leverage precision via filling and durable capping to prevent moisture ingress, fractures, and short circuits. This is always driven by the components used in the PCB, namely fine-pitch BGAs with many high pin counts. While the exact process may vary depending on the type of fill and material, here’s a general overview of how it’s done. IPC - Vias 3 Altium Designer supports vias types according to IPC-4761. PS: When I was in a PCB house, the filling process was like this - they fixed PCB into a machine and simply stir the filling over the PCB to fill out all the VIAs. Jun 17, 2025 · Discover how thermal vias improve heat dissipation in PCBs. Use offline DRC to catch any improperly connected blind vias. There are several types of vias protection detailed in the IPC-4761 Design Guide for Protection of Printed Board Via Structures and on pages 5-11 of this document. Oct 21, 2024 · Explore Altium Designer technical documentation for Working with Pads & Vias and related features. Jan 4, 2022 · PCB Standard Via Sizes and Pad Size Basics Every via should have a landing pad on the surface layers where traces can make an electrical connection; the question is how large the via pad needs to be. Learn how to set up design rules for via-in-pad in Altium Designer with this step-by-step guide. . Feb 1, 2023 · Explore Altium Designer technical documentation for Blind, Buried & Micro Via Definition and related features. com Via Tenting, Plugging, and Filling There are many reasons a printed circuit board designer might want to have a via tented, plugged or filled. Dec 13, 2019 · Please, @ale210 when you figure it out (or if everyone else has specified filled VIAs in altium), let us know. Jan 21, 2025 · This page looks at the PCB Editor's support for via stitching (used to tie together larger copper areas on different layers) and via shielding (used to help reduce crosstalk and electromagnetic interference in a route that is carrying an RF signal) May 8, 2018 · Hi, I'm getting a 6 layer board made which includes blind micro vias. - I have some vias from Top layer down1 to L1 (lets call those typeA) - I also 4. BV1, BV2) for easy identification. Inspection Standard: Completely opaque.